Extra Large Core Shape, More Cooling Performance
The new LGA1700 socket caters for processors with larger package sizes compared to previous desktop processor generations. To ensure maximum contact and thermal transfer, Akasa has increased the contact area between the cooler core and the processor in order to maximise heat dissipation and cooling performance.
Low-Profile and Compact
Maximum heatsink height of 29.92mm which makes it perfect for low-profile systems and Small Form Factor (SFF) such as Mini-ITX, Cube and HTPC cases.
Intelligent and Optimised Design
Hi-performance aluminium heatsink and copper core coupled with an embedded fan that features intelligent PWM function, delivers as much air as needed at any given time to cool the CPU. Coupled with hi-grade thermal interface pre-applied. Ensuring that the cooler delivers outstanding cooling performance.
New and Easy Mounting Design
New push-pin design to cater for the Intel® LGA1700.
Array of Compatibility
Supports common desktop motherboards such as ATX, Micro-ATX, Mini-ITX, and Thin Mini-ITX.
• Height of the heatsink is only 29.92mm
• Compatible with Intel® LGA 1700
• Intelligent PWM and silent fan
• High airflow
Tekniset tiedot:
Socket Type: Intel® LGA1700
Dimensions: 87.2 x 85.2 x 29.92 mm (W x D x H)
Heatsink Material: Aluminium with copper core
TDP Support: 73W TDP
Installation: Push Pins
Fan Dimension: Ø74 x 15mm
Fan Speed: 600-3000 RPM (PWM controlled)
Max Airflow: 33.50 CFM
Max Air Pressure: 3.76mm-H2O
Max Noise Level: 28.71 dB(A)
Voltage Rating / Current Rating: 12V DC / 0.19A
Bearing Type: HDB
Fan Life Expectancy: 50,000 hours / 25°C
Fan Connector: 4-Pin PWM
